A circular 12 V LED board designed for growing plants. The board uses a single-sided, 80 mm aluminum MCPCB with 20 red LEDs and 3 blue LEDs. A medium Daiso aluminum makgeolli cup serves as the heatsink and mechanical structure.
- Current KiCad design:
v1.0.3(2026-07-27) - Manufacturing order version:
v1.0.2(2026-07-11) - Current phase: awaiting MCPCB production and delivery
v1.0.3change: addedF.Silkscreenguides around the six M3 mounting holes and the central cable hole- DRC: 0 active errors, 0 active warnings, and 0 unconnected pads
- Exclusion: one warning for the unavailable source library of an embedded silkscreen graphic
The design files in this repository are currently at
v1.0.3. The previews below and the ordered MCPCB arev1.0.2. Manufacturing files forv1.0.3have not been generated.
| Item | Specification |
|---|---|
| PCB | 80 mm diameter, 1-layer Aluminum MCPCB |
| PCB thickness | 1.6 mm |
| Copper | 1 oz, F.Cu only |
| Surface finish | HAL SnPb |
| Solder mask / silkscreen | White / black, front side only |
| Power input | 12 V from a USB-C PD trigger board |
| Target power consumption | Approximately 2 W to 4 W |
| LEDs | 20 red and 3 blue |
| Resistors | Four 68 Ω and one 82 Ω, 2010 package |
| Track widths | 1.2 mm power tracks and 0.6 mm LED interconnects |
| Mounting holes | Six 3.2 mm M3 NPTH holes |
| Cable hole | One central 5.3 mm NPTH hole |
Because KiCad requires an even number of copper layers, the project represents the stackup as a 2-layer board. All electrical copper is on F.Cu; B.Cu is unused. The actual manufacturing structure is F.Silkscreen / F.Mask / F.Cu / thermal dielectric / aluminum base.
| Channel | LEDs per Series String | Parallel Strings | Total LEDs | String Resistor |
|---|---|---|---|---|
| Red | 5 | 4 | 20 | 68 Ω |
| Blue | 3 | 1 | 3 | 82 Ω |
The 2010 resistor bodies act as physical jumpers to complete the single-sided routing. Twenty-four F.Cu copper zones around the LEDs provide electrical connectivity and local heat spreading. The aluminum core is the primary thermal path, so the design does not use B.Cu heat-spreading copper or thermal vias.
A photograph will be added after the MCPCB arrives. It will show the holes, solder mask, silkscreen, and surface quality.
A powered-on photograph will be added after the LEDs and aluminum cooling structure have been assembled.
- The red
IWS-L5056-UR-N3and blueIWS-L5056-UB-K3LEDs use opposite footprint polarities. Verify every LED before placement. - Do not rely on cable colors. Measure the 12 V output and polarity with a multimeter before soldering the cable to
J1 +12VandJ2 GND. - Fit a grommet or strain relief where the cable passes through the central hole.
- Apply electrically non-conductive
UPSIREN UTP-8in a thin, even layer between the PCB and the aluminum cup. - Use insulating washers or nylon shoulder washers at the M3 mounting points.
- Before applying power and again after final assembly, verify that the aluminum structure and fasteners are not shorted to
+12VorGND. - The aluminum structure and external bracket, rather than the PCB, must carry the lamp's mechanical load.
plant led.kicad_sch: schematicplant led.kicad_pcb: PCB layoutplant led.kicad_pro: KiCad project settingsparts_list.md: parts, manufacturing, and assembly specificationsto-do.md: production, assembly, and test statusreferences/datasheets: LED datasheets
Manufacturing Gerber files are not included in the repository. The footprints: library is also stored in an external directory shared by multiple projects. To open the project in another environment, configure the same shared library path.
This project is licensed under the MIT License.


